NXP Semiconductors
SE95
Ultra high accuracy digital temperature sensor and thermal watchdog
?NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 2 September 2009
Document identifier: SE95_7
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section Legal information.
21. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 4
7.1
General operation. . . . . . . . . . . . . . . . . . . . . . . 4
7.2
OS output and polarity . . . . . . . . . . . . . . . . . . . 6
7.3
OS comparator and interrupt modes . . . . . . . . 6
7.4
OS fault queue . . . . . . . . . . . . . . . . . . . . . . . . . 6
7.5
Shutdown mode . . . . . . . . . . . . . . . . . . . . . . . . 7
7.6
Power-up default and power-on reset. . . . . . . . 7
8
I
2
C-bus serial interface . . . . . . . . . . . . . . . . . . . 7
8.1
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 7
8.2
Register list. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
8.3
Register pointer . . . . . . . . . . . . . . . . . . . . . . . . 8
8.4
Conguration register . . . . . . . . . . . . . . . . . . . . 9
8.5
Temperature register. . . . . . . . . . . . . . . . . . . . . 9
8.6
Overtemperature shutdown threshold
and hysteresis registers . . . . . . . . . . . . . . . . . 11
8.7
Protocols for writing and reading
the registers . . . . . . . . . . . . . . . . . . . . . . . . . . 12
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15
10
Recommended operating conditions. . . . . . . 15
11
Static characteristics. . . . . . . . . . . . . . . . . . . . 16
12
Dynamic characteristics . . . . . . . . . . . . . . . . . 17
13
Performance curves . . . . . . . . . . . . . . . . . . . . 18
14
Application information. . . . . . . . . . . . . . . . . . 19
15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
16
Soldering of SMD packages . . . . . . . . . . . . . . 22
16.1
Introduction to soldering . . . . . . . . . . . . . . . . . 22
16.2
Wave and reow soldering . . . . . . . . . . . . . . . 22
16.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22
16.4
Reow soldering . . . . . . . . . . . . . . . . . . . . . . . 23
17
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 24
18
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 25
19
Legal information. . . . . . . . . . . . . . . . . . . . . . . 26
19.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 26
19.2
Denitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
19.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
19.4
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
20
Contact information . . . . . . . . . . . . . . . . . . . . 26
21
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
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